Laser fracture ablation and grinding technique for ceramic materials

碩士 === 華梵大學 === 機電工程研究所 === 91 === ABSTRACT A new laser machining technique developed from the concept of fracture machining was proposed to produce a micro-removal of ceramic material. A focused laser is scanned along a constant direction to generate micro-cracks on ceramic substrate, fo...

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Bibliographic Details
Main Authors: Chuen-Heng Ou, 歐春亨
Other Authors: Chwan-Huei Tsai
Format: Others
Language:zh-TW
Published: 2003
Online Access:http://ndltd.ncl.edu.tw/handle/71969398331171249946

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