A Study on Plasma Enhanced Adhesion Performance of Copper to Polyimide
碩士 === 義守大學 === 材料科學與工程學系 === 91 === The main purpose of this research is to study the on Plasma Enhanced Adhesion, Surface Energy Performance of Copper to Polyimide and the physical properties. Electron Spectroscopy for Chemical Analysis（ESCA） and Fourier Transform Infrared Sp...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36585555045123286626 |