Numerical Simulation of Fluid Film Lubrication in Chemical-Mechanical Polishing Process
碩士 === 國立中興大學 === 機械工程學系 === 91 === Abstract The CMP technique has emerged as a primary process for global planarization to patterned wafers in ultra-large-scale-integration manufacture nowadays. This study is aimed at analysis of the thin fluid film in the wafer-pad interface during...
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/72636512422584854929 |