Study of Increasing Thermal Conductivity of the AlN╱Epoxy Composites
碩士 === 國立成功大學 === 化學工程學系碩博士班 === 91 === Some important properties for manufacturing semiconductor packaging are: high values of thermal conductivity, low values of dielectric constants, relatively low values of thermal expansion coefficient and low water uptake. Thus, in this study, AlN (Aluminum N...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/74013260631060146994 |