Investigations on the Electrical Properties and Material Reaction Behavior of Solder Bumps Produced by Stencil Printing
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 91 === The objective of this research was to investigate the mechanical and electrical properties of solder bumps produced with solder paste by printing. The shear strength of solder bumps and the interfacial reaction behavior between solder and UBM was investiga...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/58066995814221539239 |