Characteristics of Ta-Si-N Thin Films and their Performances as Diffusion Barriers
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 91 === Ta-N based diffusion barrier has been used widely in copper interconnection system in IC. However, Ta-N films are mostly polycrystalline and the grain boundaries will serve as expedient diffusion paths. To overcome this problem, amorphous thin films of Ta-S...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/03550684599367418483 |