Study of Adding Sb into Lead-free Sn-Ag Solder Joints on Metallurgical and Mechanical Properties
博士 === 國立成功大學 === 機械工程學系碩博士班 === 91 === The work discussed the effect of adding 1 — 2 wt% Sb on the melting point temperature, hardness, microstructure, adhesive strength and shear strength of Sn3.5Ag solder and solder joints. The effect of cooling rate on the microstructure and hardness of Sn3.5Ag...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/84123187913467802594 |