Thermal Strain Measurement of BGA Electronic Package by Phase Shifting moire interferometry Method
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 91 === The method of moire interferometry is a kind of the optical technique of full-field measurement of displacement and strain. We can measure displacement and strain in x-direction and y-direction directly by use of the number and the distribution of the fringes...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/00324210613811142616 |