Electromigration in Eutectic SnPb Flip Chip Solder Bumps
碩士 === 國立交通大學 === 材料科學與工程系 === 91 === Tin-Lead solders have been widely used to bond chips to their substrates for electrical connection and packaging. In certain applications, solid solder reaction is of serious concern owing to high temperature environment and high current density, espe...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/53392265109814630030 |