Preparation of Ni/Cu Bumps Using Electroless Plating Technique and Interfacial Reactions of Solder and Ni/Cu Layers
碩士 === 國立交通大學 === 材料科學與工程系 === 91 === This work utilized the electroless plating technology, accompanying with the photolithography and etching processes, to prepare Ni/Cu double-layered metal bumps on AlN substrate. In addition, by depositing solder by electro-plating on Ni/Cu to simulate the inter...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/91940373364179035395 |