Electromigration Studies of SnAg3.5 Flip Chip Solder Bumps
碩士 === 國立交通大學 === 材料科學與工程系 === 91 === Lead-free solders replaced traditional SnPb solders gradually due to the call for environmental protection. So far, many kinds of lead-free solders are proposed. Each of them has its unique properties. None of them could replace tin-lead solders co...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/44112004386531742981 |