Plasma Treated Ta, Ti, and Hf-based Diffusion Barriers for Copper Metallization System
博士 === 國立交通大學 === 機械工程系 === 91 === In this thesis, in order to promote barrier properties to apply in copper metallization, various diffusion barriers and surface treatments on deposited barrier films were prepared. The contents includes the optimum condition of Ta and TaN barrier films was set up,...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/38763350823581623724 |