Self-formed Reaction Barrier of Cu-Ni-Sn Ternary Compound Layer for UBM of Flip-Chip Solder Bumps
碩士 === 國立中央大學 === 化學工程與材料工程研究所 === 91 === ABSTRACT In the first part of this thesis, the interaction between Cu-Sn and Ni-Sn interfacial reactions in a soldering system has been studied by using a Ni-Sn3.5Ag-Cu sandwich structure. A layer of Cu-Sn intermetallic compound was observed at the int...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/77242864301145851834 |