A Study on Optimal Parameters Setting of Wire Bonding Quality in IC Assembly
碩士 === 國立高雄第一科技大學 === 機械與自動化工程所 === 91 === In this thesis, we investigate and optimize the parameters setting of TFBGA (Thing Film Ball Grid Array) wire bonding process in IC industry. Two important inspection methods, ball-shear force test and wire pull test, are used as the quality index of wire b...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/21822218100281487830 |