The Study of Joint Strength and Microstructure for Lead-free and Fluxless AuSn Solders
碩士 === 國立中山大學 === 光電工程研究所 === 91 === The joint strength and fracture surface of Sn80％Au20％ and Sn20％Au80％ solders in laser diode package under thermal aging testing were studied experimentally. The AuSn thin film solders were coated on the substrate by electro-plating technique. The Sn80％Au20％ solde...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/23502497969388046613 |