The Electrical Properties of Liquid-Phase Deposited SiOF Films with Annealing Treatment

碩士 === 國立中山大學 === 電機工程學系研究所 === 91 === With increasing integration density of very large scale integrated (VLSI) devices, multilevel metallization technology is becoming more important than it used to be. In advanced logic devices, the interlayer dielectrics have increased to four or five layers. Si...

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Bibliographic Details
Main Authors: Shu-Ming Chang, 張書銘
Other Authors: Ming-Kwei Lee
Format: Others
Language:en_US
Published: 2003
Online Access:http://ndltd.ncl.edu.tw/handle/11670271403397537683

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