The Study of Anisotropic Copper Etching with

博士 === 國立清華大學 === 化學工程學系 === 91 === Copper etching becomes a difficult process for outer layers of printed circuit boards (PCBs) because of the circuitry miniaturization. Ammoniacal cupric solution is one of the most common etchants used because of its high etching rate (40~70m min-1). However, it...

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Bibliographic Details
Main Authors: Chao-Wen, Shih, 史朝文
Other Authors: Chi-Chao, Wan
Format: Others
Language:en_US
Published: 2003
Online Access:http://ndltd.ncl.edu.tw/handle/54597111804082633008