Analysis of Anisotropic Copper Electroplating for IC Interconnects
博士 === 國立清華大學 === 化學工程學系 === 91 === Void-free electroplating for IC copper interconnects was examined theoretically and experimentally. In Chapter 2, a theoretical model based on electrochemistry and thermodynamic calculation for species’ microscopic concentrations was developed to discus...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/79055208999861529426 |