Design, Reliability and Thermal Analysis of Micro-Electronic Devices Packaging
博士 === 國立清華大學 === 動力機械工程學系 === 91 === In order to meet the needs of electronic products, various packaging techniques such as TSOP, BGA, Flip Chip, and WLCSP are actively being developed. However, it is rather difficult to quickly and effectively analyze each new design that shows up in the electron...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/14998766126085204219 |