A Study of Microelectronics Probing Depth and Electromigration Effect of Solder Bump
博士 === 國立清華大學 === 動力機械工程學系 === 91 === Flip chip packaging has become popular due to its high density, short possible leads, fast signal transmission, low inductance, excellent noise control, good heat dissipation. Probe-after-bump has been the primary procedure for the flip chip device ov...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/65416396019213849943 |