Study of the low temperature LPCVD diffusion barrier TaN film

碩士 === 國立清華大學 === 電子工程研究所 === 91 === We developed a low-pressure chemical vapor deposition (LPCVD) TaNx system and deposited TaNx films as diffusion barriers, the films were grown at the temperature of 400~450℃ using tantalum pentabromine (TaBr5), ammonia (NH3) as co-reactants, and argon...

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Bibliographic Details
Main Authors: Yao-Lin Huang, 黃瑤琳
Other Authors: Fon-Shan Huang
Format: Others
Language:zh-TW
Published: 2003
Online Access:http://ndltd.ncl.edu.tw/handle/02364424743876256893