The fabrication of Cu nanowire

碩士 === 國立清華大學 === 電子工程研究所 === 91 === We developed the electrochemical displacement method for Cu nanowire formed by replacing the silicon and the amorphous-silicon on SiO2/Si structure with electron beam lithography. The various line width from 0.1μm to 0.2μm were patterned by e-beam resi...

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Bibliographic Details
Main Authors: Hong-Da Chang, 張宏達
Other Authors: Fon-Shan Huang
Format: Others
Language:zh-TW
Published: 2003
Online Access:http://ndltd.ncl.edu.tw/handle/45817584357578501894