Microfabrication of Capacitive Ultrasonic Transducers

• Main Author: 黃炫貴
• Other Authors: 陳柏台
• Format: Others
• Language: zh-TW
• Published: 2003
• Online Access: http://ndltd.ncl.edu.tw/handle/32303273283066841401

碩士 === 國立海洋大學 === 系統工程暨造船學系 === 91 === The main focus of the study is to implement the design and microfabrication for phased-array ultrasonic transducers using MEMS technology. The capacitive ultrasonic transducers (cMUTs) combining CMOS process technology is the potential renovation in high tech area. The transducer is designed by a low-stress silicon membrane in which the cavity is formed by a sacrificial layer etching. And it operates by a DC voltage and the AC exciting signal in the range of 1~ 3 MHz. Theoretical analysis and computer simulations of capacitive ultrasonic transducer array are reported. Surface-micromachining techniques such like LPCVD, dry etching, wet etching , and lithography are applied in this study. The cavity of ultrasonic transducer is vacuum-sealed using LPCVD process for immersion application. Several important issues regarding fabrication process have been raised and discussed in this study.