Block and Input/Ouput Buffer Placement in Flip-Chip Design
碩士 === 國立臺灣大學 === 電子工程學研究所 === 91 === The flip-chip package gives the highest chip density of any packaging method to support the pad-limited ASIC design. One of the most important characteristics of flip chip designs is that the input/output buffers could be placed anywhere inside a chip...
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| Format: | Others |
| Language: | en_US |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/61649670636516290542 |