Chemical mechanical polishing analyzing and design of polishing head with polishing path discussing in face-up chemical mechanical polishing system
碩士 === 國立臺灣大學 === 電機工程學研究所 === 91 === Cause the improvement in the IC Technology. In the 0.25um Technology, CMP becomes the key technique in the IC manufacture. The CMP flatness isn’t really easy controlled as the concept because this architecture which use chemical and mechanical method...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36654919935718163288 |