Chemical mechanical polishing analyzing and design of polishing head with polishing path discussing in face-up chemical mechanical polishing system

• Main Author: 巫建儀
• Other Authors: 陳永耀
• Format: Others
• Language: zh-TW
• Published: 2003
• Online Access: http://ndltd.ncl.edu.tw/handle/36654919935718163288

碩士 === 國立臺灣大學 === 電機工程學研究所 === 91 === Cause the improvement in the IC Technology. In the 0.25um Technology, CMP becomes the key technique in the IC manufacture. The CMP flatness isn’t really easy controlled as the concept because this architecture which use chemical and mechanical method at the same time. So it’s very important to develop a scheme which include the method of polishing and the prediction of the burnishing. Recently, so many researches focus on the scheme of the polishing and try to develop the rule to build the model of burnishing. In this paper, first we analyze and compare the model of mechanical polishing and try to develop another suitable model. We use the information from IC manufacturers to verify our model and compare with some famous mechanical model. The Face-up machine is affected by the polishing path. We summarize the information between the polishing head and the polishing path and develop a new architecture and the scheme of polishing. Hope this paper will be useful for the research of CMP machine.