Ultra Precision Grinding of Silicon Wafers

碩士 === 國立臺灣大學 === 機械工程學研究所 === 91 === Abstract Silicon wafers are most extensively used materials for IC substrates. A single crystal silicon ingot before taking the form of wafers must go through a series of machining processes including slicing, lapping, surface grinding, edge profiling...

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Bibliographic Details
Main Authors: Hung Yi Huang, 黃弘毅
Other Authors: Ho. Z. Young
Format: Others
Language:zh-TW
Published: 2003
Online Access:http://ndltd.ncl.edu.tw/handle/15301360032924188148