Ultra Precision Grinding of Silicon Wafers
碩士 === 國立臺灣大學 === 機械工程學研究所 === 91 === Abstract Silicon wafers are most extensively used materials for IC substrates. A single crystal silicon ingot before taking the form of wafers must go through a series of machining processes including slicing, lapping, surface grinding, edge profiling...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/15301360032924188148 |