Mathematic modeling and analyzing for CMP removal rate
碩士 === 國立臺灣科技大學 === 機械工程系 === 91 === This study is primarily aimed at slurry flow between surface of wafer and pad in CMP system. It is necessary to consider the influence in hydrodynamic effect and boundary lubrication effect during polishing and find out several important characteristic...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/74068460978730996653 |