Influence of Ultrasonic Irradiation on Electroplating Copper Metallization of ULSI
碩士 === 南台科技大學 === 化學工程系 === 91 === The electroplating is the major method for IC interconnection metallic process. The electroplating method has some advantages of low cost, low toxicant, high deposition rate, good quality of the copper film morphology and simple operation system, but the defect is...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/02849306341110549248 |