| Summary: | 碩士 === 淡江大學 === 機械與機電工程學系 === 91 === This thesis describes the parylene MEMS technology as well as the low-temperature processes of surface micromachinings to fabricate the micro-chambers with parylene diaphragms. Such a low-temperature process below 120℃ can lower the entry-barrier to the surface micromachining and reduce the complexity of process integration in MEMS along with the cost effectiveness in developing time and price.
Based on the characteristic of the fabrication of parylene C, this work used the positive photoresist AZ4620 as the sacrificial layer and wrapped it with the room-temperature growth parylene C as the structural material of micro-chambers. The solution to the stiction issue of weak, levitated parylene structure is also mentioned. Additional metal electrodes integration into the parylene micro-chambers can be easily applied to the design of capacitive pressure sensors or electrostatic micromirror actuators.
Due to the need of the fabrication of parylene, the work also discusses all kinds of parameter (e.g. parylene film deposit, parylene etch rate) of parylene as the database of its fabrication application. This work indicates that the outstanding characteristics of parylene, such as its being low-temperature deposited, easy to pattern and suitable to many uses (e.g. structure layer, passivation, etching masking), will justify itself as a potentially, extensively applied material in the MEMS field.
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