Design and Processing of the Novel Package
碩士 === 大同大學 === 機械工程研究所 === 91 === Recently, IC package technology continue to get the advancement, and flip chip package technology turns into an important package. The rework of flip chip bonding, removing the underfill and bumps, will make the contamination between the chip and substrate. In this...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/72387896764885840616 |