The Study of Using Soft Computing To Find The Best Parameter of wire bonding process in Semiconductor Packaging Process
碩士 === 國立雲林科技大學 === 工業工程與管理研究所碩士班 === 91 === In recent year, the trend for electronic products is light, slim, short and small. Regarding to the chip numbers in an IC, the number of chips doubles in 18 months. This phenomenon is the well-known by IC industrial engineers as Moore’s Law. Therefore,...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/80460591971654420521 |