Strain Energy Release Rate in a multi-layer beam with intetrfacial crack
碩士 === 元智大學 === 機械工程學系 === 91 === Multi-layer structures are common in electronic package especially for the micro devices manufactured Via the semi-conductor processes or MEMS processes. Interfacial crack due to the delamination significantly weakens the multi-layer structure. It is desi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/20190069109729446381 |