Innovative Methods for Enabling Thermosonic Wire Bonding for Chips with Copper Interconnects：An Interfacial Phenomena Approach
碩士 === 國立中正大學 === 機械系 === 92 === The miniaturization of electronic components causes the signal delay phenomenon to become increasingly pronounced, and hence limits the ability of these devices to satisfy the requirements of high frequency and high-speed transmission. An effective means o...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54259525764899142757 |