Flow Analysis for Underfill of Flip-Chip Packages

碩士 === 中原大學 === 機械工程研究所 === 92 === Flip-Chip is an interconnection technique of advanced electronic device. The advantages of Flip-Chip are high I/O counts, short electronic signal path and small size. Most of electronic device of Flip-Chip are packaged by underfill that the encapsulant was driven b...

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Bibliographic Details
Main Authors: Cheng-Chang Lai, 賴成展
Other Authors: Wen-Ren Jong
Format: Others
Language:zh-TW
Published: 2004
Online Access:http://ndltd.ncl.edu.tw/handle/b7kkz6