| Summary: | 碩士 === 中原大學 === 機械工程研究所 === 92 === Flip-Chip is an interconnection technique of advanced electronic device. The advantages of Flip-Chip are high I/O counts, short electronic signal path and small size. Most of electronic device of Flip-Chip are packaged by underfill that the encapsulant was driven by capillary force into the space between the chip and substrate. Underfill technique can protect the electrical device and prevent the device from destroying because of external force. Underfill has many defects including the fill <a href="http://www.ntsearch.com/search.php?q=time&v=56">time</a> is too long, the situation of short shot and air trap are caused easily, the yield of product of Flip-Chip is not highest and the products are universal. Therefore, there are many factors being studied in this paper to sum up the influence of underfill of Flip-Chip process cause by model parameters.
The theory of underfill of Flip-Chip was studied in the first part of the paper. The fill <a href="http://www.ntsearch.com/search.php?q=time&v=56">time</a> equation was corrected and calculated by dynamic surface tension. Therefore, the Runge-Kutta method was used in program to compare the characteristics of fill <a href="http://www.ntsearch.com/search.php?q=time&v=56">time</a> equation and corrective equation. The experiment was established in second part to measure the fill <a href="http://www.ntsearch.com/search.php?q=time&v=56">time</a> of underfill flow. The influences of gap height, bump pitch and bump pattern were discussed, at the same <a href="http://www.ntsearch.com/search.php?q=time&v=56">time</a>, the CAE <a href="http://www.ntsearch.com/search.php?q=software&v=56">software</a> was used to simulate the fluid flow. Compare the experimental results with analytical results and sum up the factors which affect the flow front of underfill to find the method which can control the flow front, reduce the chance of short shot and air trap; therefore, enhance the reliable of underfill process of Flip-Chip.
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