Flow Analysis for Underfill of Flip-Chip Packages
碩士 === 中原大學 === 機械工程研究所 === 92 === Flip-Chip is an interconnection technique of advanced electronic device. The advantages of Flip-Chip are high I/O counts, short electronic signal path and small size. Most of electronic device of Flip-Chip are packaged by underfill that the encapsulant was driven b...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/b7kkz6 |