The Survey of the R&D Performance Metrics—A case Study in the IC Packaging and Testing Industry

碩士 === 朝陽科技大學 === 工業工程與管理系碩士班 === 92 === Today, technologies are developed so rapidly that the life cycles of the products are correspondingly reduced. To reduce the cost and earn the profit, the products are marketing all around the world. As a result, the development of new products becomes more...

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Bibliographic Details
Main Authors: Chuan-Ying Wu, 吳權穎
Other Authors: none
Format: Others
Language:zh-TW
Published: 2004
Online Access:http://ndltd.ncl.edu.tw/handle/y96xz9