A study of miniature and bio-compatibility for Implantable Microstimulating Module

碩士 === 義守大學 === 材料科學與工程學系 === 92 === Integrated circuit (IC) reassembly technology was devepled in this work. Due to the size of IC package module is too big to perform for our animal experiment. We have to re-lay out the circuitry and re-designed a new mask to shrinkage the area on the flexible p...

Full description

Bibliographic Details
Main Authors: J.H. Lee, 李家豪
Other Authors: 鍾卓良
Format: Others
Language:zh-TW
Published: 2004
Online Access:http://ndltd.ncl.edu.tw/handle/19641125954037506043