A study of miniature and bio-compatibility for Implantable Microstimulating Module
碩士 === 義守大學 === 材料科學與工程學系 === 92 === Integrated circuit (IC) reassembly technology was devepled in this work. Due to the size of IC package module is too big to perform for our animal experiment. We have to re-lay out the circuitry and re-designed a new mask to shrinkage the area on the flexible p...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/19641125954037506043 |
| Summary: | 碩士 === 義守大學 === 材料科學與工程學系 === 92 === Integrated circuit (IC) reassembly technology was devepled in this work. Due to the size of IC package module is too big to perform for our animal experiment. We have to re-lay out the circuitry and re-designed a new mask to shrinkage the area on the flexible polyimide subtrate. The device was extracted from a IC package and die attached on the flexible polyimide film and then re-wired bond using gold wire. According to the arithmetic unit of LM324 was sealed in a plastic package by expoy based resin. If we extracted the device and reassemblied it. The occupied area of devices can be reduced to only 1.2％ of the original size.
We also diesign different gold bumps density cuff electrodes to measure the sign of tibia nerve of rabbit. We got different contrast of sign of tibia nerve. In addition, we also characterized the material properities of the parylene materials. It exhibit a good properties of resistant acid and base and also easily fully covered on another material surface. The role of Parylene C like a plastic bag can protect our IC devices from the tissue fluid and inert in body. It are evaporated and then deposited by chemical vapor deposition process. Furthermore, the biocompatible test result revealed that parale C coating with a excellent biocompatibility.
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