Electromigration of Sn-Zn solders in contact with Cu
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 92 === The electro-migration behavior of Cu/Sn-Zn series solder/Cu under a current density of 650A/cm2 was investigated in this work. Meanwhile, the role of thermo-migration was investigated by the thermo-aging experiment. The Sn-Zn series solders investigated i...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/20790456183159644761 |