The interfacial reaction between Sn-Zn series solders and Ag substrate
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 92 === The drawbacks of Sn-Zn based solders could be improved by alloying modification. This study investigated the effect of various alloying elements, Al, Ag and Ga, on the wetting behavior between the Sn-Zn based solders and Cu/Ag substrates. On the other hand,...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/82957039372385593735 |