Analysis of Printed Circuit Board Subjected to Low Velocity Drop Impact Loading
碩士 === 國立成功大學 === 航空太空工程學系碩博士班 === 92 === In recent years, the electronic products become tiny and slight due to the high packaging density for today’s electronic devices. The reliability of electronic products is getting more and more important, and become a first point of design section. This th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/25525047334846912891 |