Study of Warpage Due to P-V-T-C Relation of EMC in IC Packaging
博士 === 國立成功大學 === 機械工程學系碩博士班 === 92 === Abstract Warpage and residual stresses problems play an important role in IC encapsulation processes. Previous research works have focused on stresses or warpage analyses with temperature changes between constituent materials and neglect cure shrinkage effec...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/25336107118540316448 |