Measurement and Analysis of Adhesion Force on IC Encapsulation Mold

博士 === 國立成功大學 === 機械工程學系碩博士班 === 92 ===   In IC packaging, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion occurs in the interface between EMC and mold surface. Too large an adhesion force can damage an IC and lower the yield rate. Many parameters will...

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Bibliographic Details
Main Authors: Shyang-Jye Chang, 張祥傑
Other Authors: Sheng-Jye Hwang
Format: Others
Language:zh-TW
Published: 2004
Online Access:http://ndltd.ncl.edu.tw/handle/75309601651376508763