Measurement and Analysis of Adhesion Force on IC Encapsulation Mold
博士 === 國立成功大學 === 機械工程學系碩博士班 === 92 === In IC packaging, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion occurs in the interface between EMC and mold surface. Too large an adhesion force can damage an IC and lower the yield rate. Many parameters will...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/75309601651376508763 |