Modeling the Post-Mold Cure Behavior of EMC
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 92 === EMC (epoxy molding compound) is used to encapsulate IC in electronic packaging fields. One critical issue for manufacturing of IC packaging is the warpage induced during the molding process. In order to minimize the warpage, process-dependent material models...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/80498860709281320291 |