The Construct of New Cluster Index for Wafer Defects

• Main Authors: Wen-Jie Tsai, 蔡文傑
• Other Authors: Lee-Ing Tong
• Format: Others
• Language: zh-TW
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/48935418055244694513

碩士 === 國立交通大學 === 工業工程與管理系 === 92 === Yield is the important index to evaluate the product quality or the capability of manufacturing process for Integrated Circuit (IC) manufacturers. There are many factors affecting the IC yield. One is the total number of defects on a wafer. As the wafer size increases, the defects clustering phenomenon tends to be apparent. Therefore, many cluster indices had been developed to detect the defect clustering. However, there are still some shortcomings in employing these cluster indices. This study develops a new cluster index, which reflects the true degree of defect clustering. To verify the effectiveness of the proposed cluster index, a simulation experiment and a regression yield model are constructed. Comparing with some existing cluster indices which are widely used in IC fabrication, the proposed cluster index not only reflects the true degree of defect clustering but is more exact in forecasting IC yield.