Studies on Flame Retardation and Low Dielectric Properties Based on Epoxy Resin
博士 === 國立交通大學 === 應用化學系 === 92 === In an electronic industrial, epoxy resin was widely applied in PCB procession and as a packaging material. Like most organic polymeric materials, the easy flammable property of epoxy resin limits its application in some areas. The requirement for a low dielectric c...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/00856193857164028282 |